NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system ...

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use ...

TSMC CEO C.C. Wei has dismissed recent market speculation indicating Nvidia is cutting back its demand for ...