The rate of change in AI algorithms complicates the decision-making process about what to put in software, and how flexible ...

A new technical paper titled “Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: ...

Plus, check out the blogs featured in the latest Low Power-High Performance newsletter: Power architect Barry Pangrle looks ...

Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by ...

Clock Modulation Covert Channel” was published by researchers at University of Rennes-INSA Rennes-IETR-UMR  and Université ...

Along with showing excellent electrical conductivity, the printed fabrics continued to perform well after 20 cycles of ...

Circuits are being pushed harder and longer, particularly with AI, speeding up the aging of data paths. Photonics adds its ...

Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Confidential Computing for Embedded RISC-V Systems” was published by researchers at IBM Research, IBM T.J. Watson Research Center, Max Planck Institute for Software Systems (MPI-SWS). Abstract ...

Aware Deep Learning on Resource-Constrained Hardware” was published by researchers at Imperial College London and University of Cambridge. Abstract “The use of deep learning (DL) on Internet of Things ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...

Chiplets will be a key enabler for customizing designs at every level, from edge devices to the cloud. AI is a key driver, ...