The rate of change in AI algorithms complicates the decision-making process about what to put in software, and how flexible ...

Plus, check out the blogs featured in the latest Low Power-High Performance newsletter: Power architect Barry Pangrle looks ...

A new technical paper titled “Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: ...

Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by ...

Confidential Computing for Embedded RISC-V Systems” was published by researchers at IBM Research, IBM T.J. Watson Research Center, Max Planck Institute for Software Systems (MPI-SWS). Abstract ...

As AI chips get larger, it becomes much harder to test them. Today, there can be as many as 22,000 pins on a 150mm² die, but in the future that number may increase to 80,000 pins. That creates a huge ...

Clock Modulation Covert Channel” was published by researchers at University of Rennes-INSA Rennes-IETR-UMR  and Université ...

Aware Deep Learning on Resource-Constrained Hardware” was published by researchers at Imperial College London and University of Cambridge. Abstract “The use of deep learning (DL) on Internet of Things ...